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EC1019
Product Features
x x x x x x DC - 4 GHz +19 dBm P1dB at 1 GHz +34 dBm OIP3 at 1 GHz 20 dB Gain at 1 GHz 5.5 dB Noise Figure at 2 GHz Available in SOT-86, SOT-89 and lead-free / green SOT-89 Package Styles x Internally matched to 50 :
The Communications Edge TM Product Information
InGaP HBT Gain Block
Product Description
The EC1019 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the EC1019 typically provides 20 dB of gain, +34 dBm Output IP3, and +19 dBm P1dB.
Functional Diagram
GND 4
1
2 GND
3 RF OUT
Applications
x x x x x x Mobile Infrastructure CATV / DBS W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless
The EC1019 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in low-cost, surface-mountable plastic SOT-86 and SOT-89 packages. The EC1019 is also available in a lead-free/green/RoHScompliant SOT-89 package. All devices are 100% RF and DC tested. The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the EC1019 will work for other various applications within the DC to 4 GHz frequency range such as CATV and fixed wireless.
RF IN
EC1019B / EC1019B-G
GND
4
RF In
1
3 RF Out
2
GND
EC1019C
Specifications (1)
Parameter
Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Large-signal Gain (3) Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current
Typical Performance (4)
Units
MHz MHz dB dBm dBm MHz dB dB dB dB dBm dBm dB V mA
Min
DC
Typ
1000 19.8 +19 +34 2000 18 15.5 19 15 +19.5 +31 5.5 5.0 70
Max
4000
Parameter
Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure
Units
MHz dB dB dB dBm dBm dB 500 21 -17 -15 +19 +34 3.8
Typical
900 19.8 -18 -15 +19 +34 4.0 1900 17.5 -19 -15 +19.5 +31 4.8

2140 16 -20 -15 +19 +30.5 5.5
System.
14
4. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = +5V, Rbias = 16.5 , 50
4.2
5.2
1. Test conditions unless otherwise noted: 25 C, Supply Voltage = +6 V, Rbias = 16.5 , 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Large-signal gain is tested with an input power level of +4 dBm.
Ordering Information
Part No.
EC1019B EC1019B-G ECG1019C EC1019B-PCB EC1019C-PCB
Absolute Maximum Rating
Parameter
Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature -40 to +85 qC -55 to +150 qC 130 mA +12 dBm +250 qC
Description
(leaded SOT-89 Pkg)
Rating
InGaP HBT Gain Block InGaP HBT Gain Block
(lead-free/green/RoHS-compliant SOT-89 Pkg)
InGaP HBT Gain Block (SOT-86 Pkg) 700 - 2400 MHz Fully Assembled Eval. Board 700 - 2400 MHz Fully Assembled Eval. Board
Specifications and information are subject to change without notice
Operation of this device above any of these parameters may cause permanent damage. WJ Communications, Inc

Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
EC1019
Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure
The Communications Edge TM Product Information
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 14 :, Icc = 70 mA
100 20.4 -17 -15 +19.4 +33 3.4 500 20.0 -17 -15 +19.4 +33.2 3.5
MHz dB dB dB dBm dBm dB
900 19.8 -18 -15 +19.4 +33.6 3.5
1900 18 -19 -15 +19.5 +31 3.8
2140 17.5 -20 -15 +19.0 +31 3.8
2400 16.8 -20 -15 +18.8 +30.7 3.9
3500 14.2 -19 -14 +16.2
5800 10.3 -11 -7.7
1. Test conditions: T = 25 C, Supply Voltage = +6 V, Device Voltage = 5.0 V, Rbias = 16.5 , Icc = 70 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
25 20
Gain vs. Frequency
0 -5 S11, S22 (dB)
S11, S22 vs. Frequency
160 120 Icc (mA)
Icc vs. Vde
Gain (dB)
15 10 5 0 0 1 2 3 4 Frequency (GHz) OIP3 vs. Frequency 40 35 30 25 20 500 25 C 1000 1500 85 C 2000 -40 C 2500 3000 5 6
-10
S22
80 25 C 40 0
-15 -20 -25 0 1 2 3 4 Frequency (GHz) 5 6 S11
0
1
2 3 Vde (V) P1dB vs. Frequency
4
5
6
Noise Figure vs. Frequency 6 5 NF (dB) 4 3 2 500 24
OIP3 (dBm)
P1dB (dBm)
20
16 25 C 1000 85 C -40 C 2500 3000
Frequency (MHz)
1000 1500 Frequency (MHz)
2000
12 500
1500 2000 Frequency (MHz)
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
EC1019
The Communications Edge TM Product Information
InGaP HBT Gain Block
Recommended Application Circuit
Vcc Icc = 70 mA
R4 Bias Resistor C4 Bypass Capacitor C3 0.018 F L1 RF Choke RF IN EC1019 C1 Blocking Capacitor C2 Blocking Capacitor RF OUT
EC1019B-PCB
EC1019C-PCB
Reference Designator L1 C1, C2, C4
50 820 nH .018 F
Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF
Recommended Bias Resistor Values 2500 18 nH 56 pF 3500 15 nH 39 pF
Supply Voltage 6V 7V 8V 9V 10 V 12 V R1 value 16.4 ohms 30.7 ohms 45 ohms 59 ohms 74 ohms 102 ohms Size 0805 1210 1210 2010 2010 2512
1. The proper values for the components are dependent upon the intended frequency of operation. 2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig. L1 C1, C2 C3 C4 R4
Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 PF chip capacitor Do Not Place 14 : 1% tolerance
Size 0603 0603 0603 0805
The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +6 V. A 1% tolerance resistor is recommended.
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
EC1019
The Communications Edge TM Product Information
InGaP HBT Gain Block
EC1019B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an "1019" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the "Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes Land Pattern
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
EC1019
The Communications Edge TM Product Information
InGaP HBT Gain Block
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
EC1019B-G (Green / Lead-free SOT-89 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with an " 1019G" designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
Land Pattern
MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
EC1019
The Communications Edge TM Product Information
InGaP HBT Gain Block
EC1019C (SOT-86 Package) Mechanical Information Outline Drawing Product Marking
The component will be marked with a twodigit numeric lot code followed by an " A" designator on the top surface of the package. Tape and reel specifications for this part are located on the website in the " Application Notes" section.
MSL / ESD Rating
ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114
MSL Rating: Level 1 at +235 C convection reflow Standard: JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135" ) diameter drill and have a final plated thru diameter of .25 mm (.010" ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
EC1019
Freq (MHz) S11 (dB)
The Communications Edge TM Product Information
InGaP HBT Gain Block
Typical Device S-Parameters - EC1019B/EC1019B-G
S-Parameters (Vdevice = +5 V, ICC = 70 mA, T = 25 C, calibrated to device leads)
S11 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-38.22 -28.54 -23.03 -19.80 -16.95 -14.97 -13.14 -11.43 -9.78 -8.16 -6.60 -5.40 -4.36
-0.60 -69.70 -116.73 -149.18 -175.69 161.78 141.18 120.25 100.23 82.20 65.82 50.97 38.35
Typical Device S-Parameters - EC1019C
S-Parameters (Vdevice = +5, ICC = 70 mA, T = 25 C, calibrated to device leads)
Freq (MHz) S11 (dB) S11 (ang)
50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000
-17.33 -17.25 -17.56 -18.41 -19.28 -20.21 -20.40 -19.31 -17.60 -15.46 -13.33 -11.61 -9.93
-1.31 -10.41 -23.16 -38.16 -59.40 -85.13 -116.07 -148.51 -175.60 161.94 142.40 126.05 111.47
Device S-parameters are available for download off of the website at: http://www.wj.com

WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
21.22 20.70 19.85 18.77 17.78 16.64 15.54 14.52 13.50 12.43 11.31 10.10 8.93
176.90 151.10 125.62 102.16 81.09 60.78 42.33 24.29 6.80 -10.58 -27.02 -42.90 -58.04
-23.21 -22.91 -22.19 -21.39 -20.49 -19.66 -18.91 -18.40 -17.96 -17.71 -17.58 -17.72 -17.94
0.43 1.81 1.88 -0.54 -4.57 -10.52 -17.61 -26.33 -35.09 -44.95 -54.92 -64.25 -73.51
-24.92 -20.21 -15.95 -13.31 -11.44 -10.17 -8.90 -7.88 -6.74 -5.73 -4.75 -3.97 -3.35
-6.19 -75.88 -118.31 -148.47 -173.35 164.24 144.05 125.10 107.67 90.92 76.11 61.95 49.09
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
20.43 19.97 19.18 18.15 17.14 16.08 15.09 14.19 13.37 12.54 11.78 10.94 10.05
177.50 155.09 132.71 112.72 94.96 78.76 64.36 50.13 36.77 23.49 10.37 -2.97 -15.41
-22.79 -22.66 -22.29 -21.69 -20.89 -20.18 -19.45 -18.76 -18.13 -17.57 -17.10 -16.77 -16.55
-0.64 4.13 7.47 9.85 10.97 10.33 8.87 5.64 1.90 -2.80 -8.33 -14.35 -20.52
-14.48 -14.68 -14.89 -15.11 -15.17 -15.08 -14.49 -13.50 -12.22 -10.85 -9.46 -8.31 -7.23
-3.98 -34.98 -66.22 -93.82 -120.65 -144.97 -168.42 169.49 151.45 136.31 123.24 111.67 100.94
Specifications and information are subject to change without notice e-mail: sales@wj.com Web site: www.wj.com December 2004

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